Nidec SV TCL will be a sponsor at the SWTest Untethered virtual event on November 11th! SWTest is the only industry conference & expo that focuses on all aspects of wafer and die level semiconductor testing. During the online workshop, Nidec SV TCL will present a technical paper entitled Challenges of Trench Probing by Jory Twitchell of NXP Semiconductor & Karan Maniar with Nidec SV TCL.
Join us at our virtual booth & chat with us about our innovative MEMS Probes & wide variety of probe cards! For more information on SWTest, go to www.swtest.org.